Education:
Mar. 2009 - Nov. 2012: School of Mechanical and Minging Engineering, The University of Queensland (UQ), Brisbane, Australia, Ph.D. in Material Engineering.
Jul. 2004 - Nov. 2008: Faculty of Built Environment and Engineering, Queensland University of Technology (QUT), Brisbane, Australia, M. Phil. (Master By research) in Mechanical Engineering.

Awards:
1.QUT Postgraduate Research Award (QUTPRA)
2.Australian Postgraduate Award (APA).
3.UQ Graduate School International Travel Award (GSITA)
4.The Best Published Material Award (UQ Postgraduate Engineering Conference 2012)

Research interests:
1.Interface reaction and solidification during brazing and soldering process.
2.Microstructure and mechanical responses of filler and solder alloys.

Research Projects:
1.National Natural Science Foundation of China (Grant Nos.: 51675191).
2.Promotion Program of Development and Application of Natural Science of Fujian Province (2018H0023).
3.Industrial linkage Collaborative Innovation Project of Xiamen City (3502Z20183020).
4.Promotion Program for Young and Middle-aged Teacher in Science and Technology Research of Huaqiao University.

Publications:

Journal Articles:

1.Yubin, Zhang, Xinjiang Liao, Qiaoli Lin, Dekui Mu*, Jing Lu, Hui Huang, Han Huang: Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite, Materials 13(7):1532.
2.Xinjiang Liao, Qiqi He, Qiaoli Lin, Dekui Mu*, Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond, Applied Surface Science 504 (2020) 144508.
3.D. Mu*, K.Y. Feng, Q.L. Lin, H. Huang, Low-temperature wetting of sapphire using Sn–Ti active solder alloys, Ceramics International, 45 (2019) 22175–22182.
4.X.J. Liao, D. Mu*, W. Fu, H. Huang, H. Huang: Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys, Materials & Design, 182 (2019) 108039.
5.J. Shen, L. Li, X. Wu, H. Chen, W.Z. Huang, D. Mu: Interfacial characteristics of titanium coated micro-powder diamond abrasive tools fabricated by electroforming-brazing composite process, International Journal of Refractory Metals and Hard Materials, 84 (2019) 104973.
6.M Li, J Chen, Q Lin, Y Wu, D Mu*: Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy, Diamond and Related Materials, 97 (2019) 107440.
7.J. Chen, X. Liao, Q. Lin, D. Mu*, H. Huang, X. Xu. H. Huang: Reactive wetting of binary Sn Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures, Diamond and Related Materials, 92 (2019) 92-99.
8.J. Chen, D. Mu*, X. Liao, G. Huang, H. Huang, X. Xu, H. Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials, 74 (2018) 52-60.
9.X. Liao, D. Mu*, J. Wang, G. Huang, H. Huang, X. Xu, H. Huang, Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, International. Journal of Refractory Metals & Hard Materials, 66 (2017) 252-257.
10.D.Mu, S.D. McDonald, J. Read, H. Huang and K. Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20，55-76 (2016).
11.G. Zeng, S.D. McDonald, D. Mu, K.Nogita, Y. Terada, H. Yasuda, Q.F. Gu, K, Nogita: Ni segregation in the interfacial (Cu, Ni)6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 21-27 (2014).
12.Y. F. Yang, D. Mu, Q.C. Jiang: A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics,143, 480-485 (2014).
13.Y. F. Yang, D. Mu: Simultaneous dehydrogenation and synthesis of TiB2-TiC through self-propagation high-temperature synthesis from TiH2-B4C powder blends. Metallurgical and Materials Transactions A, 34 (2014) 3184-3188.
14.Y. F. Yang, D. Mu: Effects of Ni additions on the formation of Ti5Si3 prepared by self-propagation high-temperature synthesis. Journal of the European Ceramic Society, 34, 2177-2185 (2014).
15.D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita: Investigating the Mechanical Properties, Creep and Crack Pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on Diverse Crystal Planes. Material Science and Engineering A, 566, 126 (2013).
16.D. Mu*, H. Huang, S. D. McDonald and K. Nogita: Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures. Journal of Electronic Materials, 42, 304 (2013).
17.Y. F. Yang, D. Mu: Dehydrogenation process and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C. Powder Technology, 249 208-211 (2013).
18.D. Mu*, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012).
19.D. Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46 (2012).
20.K. Nogita, D. Mu, S. D. McDonald, J. Read and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-XNiXSn5. Intermetallics, 26, 78 (2012).
21.D. Mu*, J. Read, Y. F. Yang and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011).
22.D. Mu*, H. Tsukamoto, H. Huang and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. Material Science Forum, Vol. 654, 2450 (2010).

Selected Conference Articles:

1.XJ Liao, QQ He, DK Mu*, H Huang, XP Xu, Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates, Solid State Phenomena 273 (2018) 181-186.
2.KY Feng, DK Mu*, XJ Liao, H Huang, XP Xu, Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy, Solid State Phenomena 273 (2018) 187-193.
3.D. Mu, Y. Sun and L. Ma, “Reliability of Multi-state Repairable Systems with Dependent Deteriorations”, Proceeding of Third Congress on Asset Management, Beijing, China, Oct., 2008.

Contact Information
E-mail: dekui.mu@hqu.edu.cn