Hui HUANG, who currently is the deputy dean of Institute of Manufacturing Engineering＆College of Mechanical Engineering and Automation in Huaqiao University.  Currently, he is the Member of The International Committee for Abrasive Technology (ICAT) (Member of the International grinding Technology Committee), senior member of Chinese Mechanical Engineering Society, general secretary of Fujian Mechanical Engineering Society, the member of National Surface Finishing Committee, the editorial member of Diamond ＆Abrasives Engineering, and Superhard Material Engineering, the director of Xiamen Key Laboratory of Photoelectric Material Machining. He has been selected into the Ten Million Leading Talents Project of Fujian Province and the National Ten Million Leading Talents Project, New Century Excellent Talents Project Supported by Ministry of Education. He has enjoyed the Special Allowance of the State Council, and has been supported by Fujian Outstanding Youth Fund and Program for Changjiang Scholars and Innovative Research Team in University, and has received Fujian Yunsheng Youth Science and Technology Award. He has long been engaged in the teaching and research of brittle material processing and superhard material tools. He has won second prize of National Science and Technology Progress Award (the second winner) and 3 first prizes of provincial and ministerial scientific research awards. He has presided more than 10 scientific research projects which included 3 projects of National Natural Science Foundation of China, published more than 100 academic papers, among which more than 40 were retrieved by SCI and EI. Also, he has applied for 15 patents, and obtained 8 approvals including 4 invention patents.

Education
1999~2002 Ph.D in Mechanical Engineering, Nanjing University of Aeronautics and Astronautics
1995~1998 M.S. in Mechanical Engineering, Huaqiao University
1991~1995 B.S. in Mechanical Engineering ,Huaqiao University

Working Experience
2010~Present  Professor, Deputy Dean, College of Mechanical Engineering and Automation＆Institute of Manufacturing Engineering, Huaqiao University
Mar.~Sept.,2012 Visiting Scholar, School of Mechanical and Mining Engineering, The University of Queensland （supported by China Scholarship Council ）
2004~2010 Associate Professor, College of Mechanical Engineering and Automation, Huaqiao University
2002~2004 Instructor, College of Mechanical Engineering and Automation, Huaqiao University

Research Interests
Ultrahard materials tools and its applications
Advanced processing technology for brittle materials

Awards＆Honors
2013, Xipeng Xu, Hui Huang, Yuan Li, Hua Guo,etc., Key technology and application of diamond abrasive tools for stone efficient processing, second prize of National Science and Technology Progress Award.
2015, Xipeng Xu, Guoqin Huang, Hui Huang, Jianyun Shen,etc., Key technology and application of metal bond to firmly control diamond abrasive particles,first prize of Fujian Provincial Technological Invention Award.
2012,Xipeng Xu, Hui Huang, Yuan Li, Jianyun Shen,etc., Key technology and application of diamond abrasive tools for  stone efficient processing, first prize of Science and Technology Progress Award of ministry of education
2008,Xipeng Xu,Yuan Li, Hui Huang, Jianyun Shen,etc., Basic research on diamond abrasive processing and tool technology of stone materials, first prize of Natural Science Award of ministry of education

Research Projects
1.2017-2020. Science and Technology Project of Fujian Province(Grant No. 2017H6014):“Development and Application of High-efficiency Precision Cutting tools for Single Crystal Silicon Carbide”
2.2014-2017. National Natural Science Foundation of China (Grant No. 51375179): “Fundamental Research of the Semiconductor Material wire saw with less cutting loss”
3.2011~2013. Science Fund for Distinguished Young Scholars of Fujian Province (Grant No. 2011J06021): “Research on the high-precision cutting technology for the single crystal SiC”
4.2010~2012. National Natural Science Foundation of China (Grant No. 50975099): “Research on the Vibration of Flexible Sawing with Diamond Wire and its Influence on the Wear of Diamond Beads”
5.2009~2011. New Century Excellent Talents in University from Ministry of Education of China (Grant No. NCET－08-0610)
6.2009~2011. New Century Excellent Talents in University from Ministry of Education of China (Grant No. NCET－08-0610)

7.2019~2022. The Major Science and Technology Project of Xiamen: “Research & Development and Industrialization of Double Grinding Wheel Parallel Grinding Intelligent CNC Cylindrical Grinder”（3502ZCQ20191007）

8.2019~2020, Program for innovation team with rolling funding supported by Ministry of Education（IRT_17R41）:“Brittle Materials Machining Technology and Equipment”（in research）

9.2017~2020, Industry-university-research Cooperation Project in Fujian Province University:“Development and industrial application of high efficiency precision cutting tool for single crystal silicon carbide”(completed)

10.2014~2017, National Natural Science Foundation of China:“Basic research on the cutting technology of narrow saw for semiconductor material”（51375179）（completed）

Patents
[1]Huang Hui, Qiu Yanfei et al. CN Patent # ZL 2016103652932, A new method to manufacture UV curable resin grinder with abrasive arranged in three-dimensional and its device.
[2]Huang Hui, He Zhaobin et al. CN Patent # ZL 201310547047, A new device using to produce the continuous long brazing wire
[3]Xu Xipeng, Liu Juan, Huang Hui, Yu Yiqing, CN Patent # ZL 200410041972.1 (Sep. 2004), A fabrication method of diamond polisihing film.
[4]Huang Hui, Xu Xipeng, CN Patent # ZL 200620072360.3 (Apr. 2006), A new brazed diamond bead.
[5]Xu Xipeng, Huang Hui, CN Patent # ZL 200620069106.8 (Jan. 2006) Brazed diamond disc.
[6]Xu Xipeng, Huang Guoqing, Huang Hui, CN Patent # ZL 200720006734.6 (Apr. 2007), A kind of abrasives bead with large chip accommodation space.
[7]Xu Xipeng, Huang Guoqing, Huang Hui, Li Yuan, CN Patent # ZL 200820103154.3 (Jul. 2008), Ultra-thin diamond segment with Grits optimized distributed.

[8]Huang Hui, Ma Fei, Xu Xipeng, Method for Microbially Dressing a Super abrasive tool, US 10576607B2.

Publications

[1]Ma F, Huang H*, Cui C. Biomachining properties of various metals by microorganisms[J]. Journal of Materials Processing Technology, Vol. 278, 116512, 2019.

[2]Ma, Fei, Huang, Hui*, Xu, Xipeng. Material removal mechanisms of Cu–Co metal-powder composite by microorganisms. International Journal of Precision Engineering and Manufacturing-Green Technology, 2019, 10.1007/s40684-019-00110-8.

[3]Hui H, Fei M. Parameter optimization for improvement in biomachining performance. Journal of Nanjing University of Aeronautics & Astronautics, Vol. 36, No. 3,, 376-386, 2019.

[4]Qiu Y, Huang H*. Research on the fabrication and grinding performance of 3-dimensional controllable abrasive arrangement wheels[J]. The International Journal of Advanced Manufacturing Technology, Vol.104, No. 5, 1839-1853, 2019.

[5]Lin Z , Huang H* , Xu X . Experimental and simulational investigation of wire bow deflection in single wire saw[J]. International Journal of Advanced Manufacturing Technology, Vol. 101, No. 1-4, 687-695, 2018.

[6]Ma Fei, Hui Huang, Xipeng Xu. State Overview and Technology Analysis of Biomachining[J].China Mechanical Engineering, Vo. 30, No. 5, 77-85, 2019.

[7]Zhishu Lin, Hui Huang, Shenglong Zheng. Theoretical Analysis and Experimental Study on Material Removal Per Length of Wire in the Cutting of Multi-wire Saw with Reciprocating[J]. Journal of Mechanical Engineering,Vol. 54, No. 13, 208-214, 2018.

[8]Yanfei Qiu, Hui Huang*, Xipeng Xu, Effect of additive particles on the performance of ultraviolet-cured resin-bond grinding wheels fabricated using additive manufacturing technology, International Journal of Advanced Manufacturing Technology, Vol. 97, No. 9-12, 3873-3882, 2018.

[9]Huang X, Huang H*, Guo H. Simulation and Experimental Research on the Slicing Temperature of the Sapphire with Diamond Wire. International Journal of Computational Methods, 2018

[10]Huang H, Li X, Xu X, et al. An experimental research on the force and energy during the sapphire sawing using reciprocating electroplated diamond wire saw. Journal of Manufacturing Science & Engineering, Vol. 139(12): 2017, 139(12).

[11]Huang H, Wang S, Xu X. Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire. Materials Science in Semiconductor Processing, Vol. 71, 93-101, 2017

[12]He Z, Huang H*, Yin F, et al. Development of a brazed diamond wire for slicing single-crystal SiC ingots. International Journal of Advanced Manufacturing Technology, Vol. 91(1-4):189-199, 2017

[13]Haiyong Wu, Hui Huang*, Feng Jiang, Xipeng Xu, Mechanical wear of different crystallography orientation for single abrasive diamond scratching on Ta12W, International Journal of Refractory Metals and Hard Materials, Vol. 54: 260-269, 2016

[14]Hui Huang, Yuxing Zhang, Xipeng Xu, Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire, International Journal of Advanced Manufacturing Technology, Vol. 81: 955-965, 2015

[15]Haiyong Wu, Huihuang, Xipeng Xu.Experimental Study for Single Diamond Grit Scratching[J]. Tribology , Vol.35, No. 5, 1-11, 2015

[16]Hui Huang, Guoqing Huang, Hua Guo, Xipeng Xu，An experimental investigation of vibration characteristics in the diamond wire sawing of granite, The 3rd International Conference on Stone and Concrete Machining, Bochum, Germany, Nov. 2-3, 2015

[17]Linglign Su, Hui Huang, Xipeng Xu. Quantitative Measurement of Grit Distribution of Diamond Abrasive Tools[J]. China Mechanical Engineering, Vol.25: 1290-1294,2014

[18]Hui Huang*, Guoqin Huang, Xipeng Xu and Han Huang, An experimental study of machining characteristics and tool wear in the diamond wire sawing of granite, Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture，Vol. 227(7): 943-953, 2013

Contact Information
Tel: 0592-6162615
E-mail:huangh@hqu.edu.cn