Education:

Sept.1999~July.2003  B.S. in Super Hard Materials, Inorganic Nonmetallic Materials Department, College of Materials Science and Engineering, Yanshan University

Sept.2003~May.2009  Ph.D. in Materials Science, State Key Laboratory of Metastable Materials Science and Technology (Yanshan University)

Working Experience:

Aug.2009~Dec.2013  Lecturer, College of Mechanical Engineering and Automation, Huaqiao University

Jan.2014~Dec.2017   Associate Professor, Institute of Manufacturing Engineering, Huaqiao University

Dec.2014~Dec.2015  Visiting scholar at the University of Texas at Dallas, USA

Dec.2017~Present      Professor, Institute of Manufacturing Engineering, Huaqiao University.

Research Interests:

Ultra-precision machining of semiconductor wafer substrates

Preparation and application of novel developed grinding and polishing tools

Surface modification of ultrafine abrasives and the interaction between abrasive and matrix

Research Projects:

1. National Natural Science Foundation of China (Youth Project), Study on ultraprecision machining technology of single crystal SiC based on semi-consolidation of single-dispersed nanodiamonds, 2012.01-2014.12 (as the project organizer)

2. National natural science foundation of China, Fundamental study on semi-consolidated flexible machining techniques of hard core-soft shell nano composite abrasive, 2015.01-2018.12 (as the project organizer)

3. National natural science foundation of China, Basic research on reaction grinding single crystal diamond substrate with metal abrasive porous ceramic wheel, 2020.01-2023.12 (as the project organizer)

4. The Science and Technology Key Project of Fujian Province of China, Research on Sapphire Wafer Polishing Technology based on Damage Detection, 2018.04-2021.03, (as the project organizer)

5. The Science and Technology Key Project of Xiamen, Research on High Efficiency and Super Fine Polishing Technology for Single Silicon Carbide Wafers, 2017.03-2020.03 (as the project organizer)

6. Program for New Century Excellent Talents in University of Fujian, Basic Research on Hybrid Abrasive Semi-consolidated Flexible Polishing Technology of Diamond Wafer, 2018.06-2020.07 (as the project organizer)

7. National Natural Science Foundation of China, Processing principle and technique research on machining single crystal diamond wafer by cooperation between active/hard abrasives, 2018.01-2022.12 (as the participant)

Papers:

1. Jianbing Zang, Jing Lu, Xuehai Qi, Yanhui Wang*. Characterization of silicon films grown by atomic layer deposition on nanocrystalline diamond. Diamond and related materials, 2006, 15(9): 1434-1437. (SCI, WOS: 000240047300039, IF:2.561)

2. Jing Lu, Yanhui Wang, Jianbing Zang*, Y.N. Li. Protective silicon coating for nanodiamonds using atomic layer deposition. Applied surface science, 2007, 253(7): 3485-3488.(SCI, WOS:000244381700022, IF=3.387)

3. Jing Lu, JianBing Zang, Shan S X, H. Huan, Yanhui Wang*. Synthesis and characterization of core− shell structural MWNT− zirconia nanocomposites. Nano letters, 2008, 8(11): 4070-4074.(SCI, WOS: 000260888600092, IF=12.712)

4. Jianbing Zang, Jing Lu, Yanghui Wang, Jinhui Zhang, X.Z. Cheng, H. Huang. Fabrication of core–shell structured MWCNT–Ti(TiC) using a one-pot reaction from a mixture of TiCl3, TiH2, and MWCNTs. Carbon, 2010, 48(13): 3802-3806. (SCI, WOS: 000281190800018, IF= 6.337)

5. Jing Lu, Qiufa Luo, Yunyun Song, Guangqiu H, Xipeng Xu. Fabrication and Application of Gel-bonded Ultrafine Diamond Abrasive Tools. JOURNAL OF MECHANICAL ENGINEERING, 2015, 51(15)：205-212. （EI，Accession number: 20153701258946）

6. Jing Lu, Yang Li, Xipeng Xu*. The effects of abrasive yielding on the polishing of SiC wafers using asemi-fixed flexible pad. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2015, Vol. 229(S1) 170-177. (SCI, WOS: 000352579400013, IF=1.366)

7. Yang Li, Jing Lu*, and Xipeng Xu. Phase transformation of monocrystalline silicon induced by polishing with diamond abrasives. IEEE Transactions on Semiconductor Manufacturing, 2015, 28(2): 153-159. (SCI, WOS: 00035418940000, IF=1.117)

8. Jing Lu*, Jianbing Zang, Yanhui Wang, Yongchao Xu, Xipeng Xu. Preparation and characterization of zirconia-coated nanodiamonds as a Pt catalyst support for methanol electro-oxidation. Nanomaterials, 2016, 6: 234. (SCI, WOS: 000392240000013, IF=3.553）

9. Qiufa Luo, Jing Lu*, Xipeng Xu. A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools. Wear, 2016, 350-351: 99-106. (SCI, WOS: 000370535900013, IF=2.531)

10.  Yongchao Xu, Jing Lu*, Xipeng Xu. Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing. Applied Surface Science, 2016, 389: 713-720. (SCI, WOS: 000384577600087, IF=3.387）

11. Qiufa Luo, Jing Lu*, Xipeng Xu. Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools. Tribology International, 2016, 104: 191-203. (SCI, WOS: 000386186500019, IF=2.903)

12. Jing Lu*, Qiufa Luo, Xianyan Mao, Xipeng Xu, Yanhui Wang, Hua Guo. Fabrication of a resin-bonded ultra-fine diamond abrasive polishing tool by electrophoretic co-deposition for SiC processing. Precision Engineering, 2017, 47: 353-361. (SCI, WOS: 000389090200035, IF=2.237)

13. Jing Lu*, Yaguang Wang, Qiufa Luo, Xipeng Xu. Photocatalysis assisting the mechanical polishing of a single-crystal SiC wafer utilizing an anatase TiO2-coated diamond abrasive. Precision Engineering, 2017, 49: 235-242. (SCI, WOS: 000402444000024, IF=2.237 )

14. Jing Lu*, Yongchao Xu, Yunhe Zhang, Xipeng Xu. The effects of SiO2 coating on diamond abrasives in sol-gel tool for SiC substrate polishing. Diamond and Related Materials, 2017, 76: 123-131. (SCI, WOS: 000403858500019, IF=2.561）(51475175, 20133501130001, ZQN-YX202).

15. Jing Lu*, Yongchao Xu, Dayu Zhang, Xipeng Xu. The synthesis of the core/shell structured diamond/akageneite hybrid particles with enhanced polishing performance. Materials, 2017, 10: 673. (SCI, WOS: 000404415000107, IF=2.654）

16. Qiufa Luo, Jing Lu*, Xipeng Xu, Feng Jiang. Removal mechanism of sapphire substrates (0001, 11-20 and 10-10) in mechanical planarization machining. Ceramics International, 2017, 43: 16178-16184. (SCI, WOS:000414106600020，IF=2.986 )

17. Yongchao Xu, Jing Lu, Xipeng Xu, Chao-Chang A. Chen, Yujing Lin. Study on high efficient sapphire wafer processing by coupling SG mechanical polishing and GLA-CMP. International Journal of Machine Tools and Manufacture, 2018, 130-131: 12-19.

18. Yingchao Lin, Jing Lu, Ruilong Tong, Qiufa Luo, Xipeng Xu. Surface damage of single-crystal diamond (100) processed based on a sol-gel polishing tool. Diamond & Related Materials, 2018, 83: 46-53.

19. Jing Lu, Qiufa Luo, Xipeng Xu, Hui Huang, Feng Jiang. Removal mechanism of 4H- and 6H-SiC substrates (0001 and 000-1) in mechanical planarization machining. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2019, 233(1): 69-76.

20. Jing Zhou, Jing Lu, Zhiping Xue, Xipeng Xu. Fabrication of fixed polishing tool by knitting diamond/CNT fiber threads on cloth. Diamond & Related Materials, 2018, 90: 229-243.

21. Jing Lu, Ping Xiao, Ruilong Tong, Qiufa Luo, and Xipeng Xu. Precision Polishing of Single Crystal Diamond (111) Substrates Using a Sol-Gel (SG) Polishing Pad. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2019, 32(3): 341-345.

Contact Information:

Tel:13055510552

Email：lujing26@hqu.edu.cn